The Excellite 8000 series wafer plating systems are designed around a unique plating tank configuration which combines planetary and orbital type movements. These actions provide the foundation for plating uniformity.

The Single Cell Version features one plating vessel, with the capacity of plating up to eight wafers at one time. A multi-channel DC power supply allows the operator to adjust the required milliamp current to each individual wafer.

The plating tank features a weir overflow plumbed to a sump tank. The sump tank houses an electric immersion heater and a filtration system. Filtered solution is returned to the plating tank through a series of vertical spargers, which circulate the flow towards the face of the wafer. A dragout rinse and an overflow rinse tank are included in the base system. Options are available for custom features, quick dump rinses, and PLC or computer control.

Wafers are mounted on individual fixtures, or arm assemblies. Each arm can be removed from the plating tank, or positioned in the tank as plating requirements dictate. The "wheel" to which the wafer is attached rotates as the entire carousel of eight arm assemblies revolves around the carousel. Inert anodes are positioned in different locations around the interior of the carousel, allowing the wafers to "see" the anodes from different angles. This results in a continuously changing distance between the anodes and the wafers. As the wafer moves continuously in relation to the anode, the problem of metal depletion at the face of the wafer is considerably reduced, keeping the deposition rate consistent. This combination of mechanical movements provides the base for superior plating results.